New PDF release: 3D Microelectronic Packaging: From Fundamentals to

By Yan Li,Deepak Goyal

This quantity presents a entire reference for graduate scholars and pros in either academia and at the basics, processing info, and purposes of 3D microelectronic packaging, an pattern for destiny microelectronic programs. Chapters written through specialists conceal the latest study effects and development within the following parts: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, complex fabrics, warmth dissipation, thermal administration, thermal mechanical modeling, caliber, reliability, fault isolation, and failure research of 3D microelectronic applications. a variety of pictures, tables, and didactic schematics are integrated all through. This crucial quantity equips readers with an in-depth realizing of all features of 3D packaging, together with packaging structure, processing, thermal mechanical and moisture comparable reliability issues, universal mess ups, constructing parts, and destiny demanding situations, supplying insights into key parts for destiny study and development. 

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3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics) by Yan Li,Deepak Goyal


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